Publicado:
2022-03-01Número:
Vol. 16 Núm. 1 (2022)Sección:
Visión InvestigadoraAnálisis computacional integrado de fotoelasticidad digital y análisis termoelástico de esfuerzos
Integrated computational analysis of digital photoelasticity and thermoelastic stress analysis
Palabras clave:
Densidad de franjas, Load stepping, Campos de esfuerzos, Campos de temperatura (es).Palabras clave:
Fringe density, Load stepping, Stress field, Temperature field (en).Descargas
Resumen (es)
La medición de los esfuerzos mecánicos es importante en múltiples aplicaciones de ingeniería, porque permite identificar las condiciones de operación que hacen que las piezas fallen. Dentro de las estrategias para medir esfuerzos mecánicos, la integración de la fotoelasticidad digital y el análisis termoelástico de esfuerzos ha sido ampliamente explorada, porque permite obtener información de esfuerzos individuales y no solo de su suma o diferencia; y porque permite análisis no invasivos y de campo completo. Sin embargo, dada la complejidad experimental de ambas técnicas, su integración suele limitarse a casos semi-estáticos, donde la calibración de los parámetros térmicos se suele hacer independientemente al montaje de fotoelasticidad. Este trabajo explora una integración computacional de la fotoelasticidad digital y el análisis termográfico de esfuerzos, mediante la aplicación de carga variable a un modelo birrefringente. Los resultados obtenidos indican que, bajo condiciones controladas, es posible obtener simultáneamente los campos de esfuerzos y de temperaturas del modelo inspeccionado. Estos resultados podrían ser de útiles entornos industriales, donde la complejidad de los experimentos limita el rango de aplicaciones que requieren análisis de campos de esfuerzos.
Resumen (en)
Stress measurement is useful to identify the operating conditions that can produce the failure of a structure. Among the strategies for stress measurement, the integration between digital photoelasticity and thermoelastic stress analysis has been extensively explored, because it is useful to determine the individual stresses, and because of its full-field capabilities. However, due to the experimental complexity of both techniques, their integration is often limited to semi-static cases, where the calibration of the thermal parameters is usually done independently of the photoelasticity experiment. This paper describes a computational integration of digital photoelasticity and thermoelastic stress analysis. The main contribution of the paper is to show that, under controlled conditions, the application of variable load can be used to determine the stress and temperature fields of a birefringent model. The results achieved of this paper could be useful in industrial environments, where the complexity of the experiments limits the range of applications that require stress field analysis.
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