DOI:

https://doi.org/10.14483/22484728.14404

Published:

2019-01-31

Issue:

Vol. 13 No. 1 (2019)

Section:

A Case-Study Vision

Reverse engineering for electronic devices: temperature and soil moisture case

Ingeniería inversa para dispositivos electrónicos: estado de temperatura y humedad del suelo

Authors

Keywords:

Electronic device, Reverse engineering, Sensor, Soil, Temperature and moisture (en).

Keywords:

Dispositivo electrónico, Ingeniería inversa, Sensor, Suelos, Temperatura y humedad (es).

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Abstract (en)

The measurement of environmental variables turns out to be a wide field in which different techniques are used to capture the desired analog signals, all of the above in order to transform them and deliver them in such a way that their interpretation is clear. This article describes a research project, which was carried out for the Institute of Hydrology, Meteorology and Environmental Studies IDEAM –Colombia–, where a reverse engineering methodology was implemented aimed at the application of proprietary technologies to generate a new device capable of measuring soil temperature and moisture, starting from the design of the electronic circuit and arriving at the simulation. All based on existing equipment for the identification of electronic components, performance curves, and input and output signals, this with the aim of conceptualizing and generating bases for the final design.

Abstract (es)

La medición de variables ambientales resulta ser un campo amplio en el cual se hace uso de diferentes técnicas para lograr captar las señales análogas deseadas con el fin de transformarlas y entregarlas de forma tal que su interpretación sea clara. El presente artículo describe los resultados del proyecto de investigación realizado para el Instituto de Hidrología, Meteorología y Estudios Ambientales IDEAM –Colombia–, donde se implementó una metodología de ingeniería inversa encaminada a la aplicación de tecnologías propias para generar un nuevo dispositivo capaz de realizar la medición de temperatura y humedad del suelo partiendo del diseño del circuito electrónico y llegando a la simulación. Todo lo anterior basándose en un equipo existente para la identificación de componentes electrónicos, curvas de comportamiento, y señales de entrada y salida, con el objetivo de conceptualizar y generar bases para el diseño final.

References

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T. Flaschke and H. R. Trankler, “Dielectric Soil Water Content Measurements Independent of Soil Properties”, IMTC/99. Proceedings of the 16th IEEE Instrumentation and Measurement Technology Conference (Cat. No.99CH36309), 1999. https://doi.org/10.1109/IMTC.1999.776716

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How to Cite

APA

Vaca, S. A. ., Serrano Vivas, E. . ., and Rangel Díaz, J. E. . (2019). Reverse engineering for electronic devices: temperature and soil moisture case . Visión electrónica, 13(1), 123–134. https://doi.org/10.14483/22484728.14404

ACM

[1]
Vaca, S.A. et al. 2019. Reverse engineering for electronic devices: temperature and soil moisture case . Visión electrónica. 13, 1 (Jan. 2019), 123–134. DOI:https://doi.org/10.14483/22484728.14404.

ACS

(1)
Vaca, S. A. .; Serrano Vivas, E. . .; Rangel Díaz, J. E. . Reverse engineering for electronic devices: temperature and soil moisture case . Vis. Electron. 2019, 13, 123-134.

ABNT

VACA, Sergio Alejandro; SERRANO VIVAS, Esteban; RANGEL DÍAZ, Jorge Eliécer. Reverse engineering for electronic devices: temperature and soil moisture case . Visión electrónica, [S. l.], v. 13, n. 1, p. 123–134, 2019. DOI: 10.14483/22484728.14404. Disponível em: https://revistas.udistrital.edu.co/index.php/visele/article/view/14404. Acesso em: 17 jul. 2024.

Chicago

Vaca, Sergio Alejandro, Esteban Serrano Vivas, and Jorge Eliécer Rangel Díaz. 2019. “Reverse engineering for electronic devices: temperature and soil moisture case ”. Visión electrónica 13 (1):123-34. https://doi.org/10.14483/22484728.14404.

Harvard

Vaca, S. A. ., Serrano Vivas, E. . . and Rangel Díaz, J. E. . (2019) “Reverse engineering for electronic devices: temperature and soil moisture case ”, Visión electrónica, 13(1), pp. 123–134. doi: 10.14483/22484728.14404.

IEEE

[1]
S. A. . Vaca, E. . . Serrano Vivas, and J. E. . Rangel Díaz, “Reverse engineering for electronic devices: temperature and soil moisture case ”, Vis. Electron., vol. 13, no. 1, pp. 123–134, Jan. 2019.

MLA

Vaca, Sergio Alejandro, et al. “Reverse engineering for electronic devices: temperature and soil moisture case ”. Visión electrónica, vol. 13, no. 1, Jan. 2019, pp. 123-34, doi:10.14483/22484728.14404.

Turabian

Vaca, Sergio Alejandro, Esteban Serrano Vivas, and Jorge Eliécer Rangel Díaz. “Reverse engineering for electronic devices: temperature and soil moisture case ”. Visión electrónica 13, no. 1 (January 31, 2019): 123–134. Accessed July 17, 2024. https://revistas.udistrital.edu.co/index.php/visele/article/view/14404.

Vancouver

1.
Vaca SA, Serrano Vivas E, Rangel Díaz JE. Reverse engineering for electronic devices: temperature and soil moisture case . Vis. Electron. [Internet]. 2019 Jan. 31 [cited 2024 Jul. 17];13(1):123-34. Available from: https://revistas.udistrital.edu.co/index.php/visele/article/view/14404

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